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Scientific Publication Citing Dragonfly

Plasma FIB deprocessing of integrated circuits from the backside

E.L. Principe (1), Navid Asadizanjani (2), Domenic Forte (2), Mark Tehranipoor (2), Robert Chivas (3), Michael DiBattista (3), and Scott Silverman (3)
Electronic device failure analysis, 19, Issue 4, November 2017: 36–44.

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Keywords

Plasma FIB, deprocessing, Integrated circuits, Defect, Failure analysis, Computationally guided miscroscopy, tomography, X-ray ct scanning, Delayering

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Abstract

Deprocessing of integrated circuits (ICs) is often the final step for defect validation in failure analysis (FA) cases with limited fault-isolation information and is an essential process for reverse engineering for design verification and competitive analysis... A new concept, based on plasma FIB deprocessing of devices from the silicon substrate backside, is now introduced to enable a greater success rate on lower- metal interconnects and high-density transistor levels.

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How Our Software Was Used

Dragonfly was used for image analysis, stitching, and visualization in a near-real-time environment.

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Author Affiliation

(1) Synchrotron Research, Inc., Melbourne Beach, Florida.
(2) Florida Institute for Cybersecurity, University of Florida, Gainesville, Florida.
(3) Varioscale Inc., San Marcos, California.

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